Gopalakrishnan, T. and Venkatesan, Raja and Chandrasekaran, M. and Deepa, Simon and Kim, Seong-Cheol (2024) Advances in implant for surface modification to enhance the interfacial bonding of shape memory alloy wires in composite resins. Progress in Organic Coatings, 188. p. 108242. ISSN 03009440
Full text not available from this repository. (Request a copy)Abstract
Shape memory alloys (SMAs) are gaining traction in aerospace, automotive, and energy sectors due to their roles as actuators, sensors, and energy converters at high temperatures. Their unique benefits have led to widespread commercial use, supported by extensive research. However, engineered metallics often face deformation and strength issues. Efforts are underway to bolster the bond between SMA wires and composite resins through advanced surface modifications. This review delves into recent surface modification techniques, challenges in SMA composite adhesion, and analytical tools like X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The study concludes with insights on promising modification strategies and the future of enhanced bonding in SMA composites.
Item Type: | Article |
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Subjects: | Mechanical Engineering > Heat Transfer |
Divisions: | Mechanical Engineering |
Depositing User: | Mr IR Admin |
Date Deposited: | 05 Oct 2024 06:10 |
Last Modified: | 05 Oct 2024 06:10 |
URI: | https://ir.vistas.ac.in/id/eprint/8670 |