Microstructural analysis of diffusion bonding on copper stainless steel

Diffusion bonding is one of the solid-state welding processes, were bonded through the diffusion welding
method. The bonding was achieved by placing the specimens under a load of pressure 5 MPa nickel layer is used in between the material and the temperate range was taken between 700 and 900 C. The findings suggested distinct diffusion were found in the different parameters. The results indicated the formation of separate diffusion zones at both Cu/Ni and Ni/S S interfaces during the diffusion bonding process. In both interfaces, the thickness required an increased inspection by rising the manufacturing temperature. The microstructure analysis also done on the diffusion boded joints with various parameters.