The effect of sintering temperature on components prepared by Cu powder mixed with binder

Abstract. Copper is one of the most widely used material for thermal conductivities, fuel cells, sensors, processor chips
of high-speed computer, and applications which require miniaturization, sophisticated design, and improved thermal
management/electrical conductivity. In the powder metallurgy, manufacturing of more difficult to machine parts areproduced by this method. In this research article, water atomized copper powder is selected and blended with the aqua-based binder, which is placed in a die and compacted with mnimal pressure. The samples were sintered in both air andnitrogen with varying three sets of 860, 980, 10000C temperatures. The fabricated components were characterized byhardness, density, porosity by various tests.